Double-sided wrapping and polishing device TR4W605K
It is ideal for the lapping and polishing of wafers such as crystal, quartz, glass, and silicon that require parallelism.
This is an ideal device for lapping and polishing that requires parallelism of wafers made of materials such as crystal, quartz, and silicon, ranging from small 3B to medium 6B and 9B.
- Company：テクノライズ株式会社
- Price：Other
